MEMS Testing and Reliability Workshop Home

MEMS testing and reliability assurance are critical processes to achieve high yields and profitability as these processes account for 40 to 70% of the total device cost. According to recent studies, the total world MEMS test equipment market generated revenues of $68.5 million in 2008, at a growth rate of 11.4 percent. While MEMS testing is similar to chip testing in the semiconductors industry, MEMS present further challenges because mechanical, chemical and optical parameters must be tested in addition to electrical properties. MEMS foundries and even fabless MEMS companies need to ensure that they have in-house expertise in MEMS testing and reliability.

Topics that will be covered at the workshop include:
• Overview of state-of-the-art MEMS testing and reliability strategies
• Wafer-level MEMS testing
• Post-packaging MEMS testing
• Specific tips and techniques
• MEMS test equipment presentations from leading suppliers

This workshop will ensure that your organization stays current with the latest MEMS testing and reliability trends and to therefore allow your company to increase yields, decrease waste and increase profitability.

Presentations and Speakers
Sponsorship Opportunities
Pricing/Registration/Cancellation
Hotel Information

Presentations and Speakers

Predicting Reliability of Silicon MEMS
Alissa M. Fitzgerald, Ph.D., Founder and Managing Member
A.M. Fitzgerald & Associates, LLC

Abstract
Mechanical reliability is critical for applications such as automotive safety systems or medical devices, but it is also important to product quality, longevity, yield, and ultimately, profit. At some point during the development of a MEMS device, engineers inevitably face what seems to be a simple question: “When will the device break?” But in the design of silicon MEMS, there are no simple answers. Silicon is a brittle material, and its failure depends on both applied load and the presence and distribution of material flaws. No two devices will break at the same load, and the variance can be large. Traditional safety-factor analysis, which compares the highest modeled stress to material yield strength, is dangerously inaccurate for brittle materials like silicon. Without a good way to answer the question, MEMS engineers have had to resort to overdesign, and expensive, time-consuming reliability testing followed by multiple design iterations.

The talk will begin with an executive summary of fracture and fatigue (time-dependent) behavior in silicon and the significant concerns and challenges in design of reliable MEMS. Executives and engineers will develop an appreciation for the impact mechanical reliability issues could have on their development timelines and budgets. Fracture prediction software, developed by our company, is a new tool for efficient design of reliable devices. An overview of the software and its use will be presented. Prediction accuracy is demonstrated for a prototype micro-mirror by comparison to data from fracture of actual devices. This new simulation tool can shorten design cycles and save money by enabling informed, simulation-driven design of reliable devices.

About the speaker
Dr. Fitzgerald has over 14 years of hands-on experience in MEMS design and fabrication and has developed over a dozen distinct MEMS devices, such as piezoresistive cantilevers, ultrasound transducers, and microcalorimeters, for applications as broad as implantable medical devices to spacecraft sensors. She is an expert on reliability of brittle materials and finite element analysis for MEMS devices, and continues to conduct research in those areas.

In 2003, she founded A.M. Fitzgerald & Associates, LLC, a MEMS R&D firm that provides early stage MEMS product development and prototyping, finite element modeling and fracture prediction, and technology transfer and strategy consulting. The company serves clients of all sizes and is one of the few vertically-integrated firms that can take client designs from the notebook all the way to pilot production.

She has previously been employed by the Jet Propulsion Laboratory, Orbital Sciences Corporation, Sigpro, and Sensant Corporation (acquired by Siemens). Dr. Fitzgerald received her bachelor and master degrees from the Massachusetts Institute of Technology and her doctorate from Stanford University, all in the discipline of Aeronautics and Astronautics.

Dr. Fitzgerald has numerous journal publications, holds two patents, and is a frequent lecturer at Stanford University and local professional group meetings. Dr. Fitzgerald is the Director of the MIT Club of Northern CA Semiconductor Entrepreneurship Series.

The 2008 MEMS Commercialization Report Card:
Focus on Design for Manufacturing and Test
Roger H. Grace, President
Roger Grace Associates

Abstract
Barriers to the commercialization of every industry and technology exist. Microelectromechanical systems (MEMS) / Microsystem Technologies (MST) and Nanotechnology are no exceptions. In his Journal of Applied Physics article, Charles Smith of Bell Labs notes the first manifestation of MEMS to be the discovery of the piezoresistive effect in Germanium and Silicon in 1954. As we have passed more than a half-century of MEMS /MST research, design, and development, many people ask, “Why has it taken so long for the MEMS/MST market and technology to realize its potential or reach the expected volumes?” Even more importantly, how can we take advantage of the “lessons learned” from our MEMS/MST experiences and put them to good use in the commercialization of Nanotechnology.

The presentation will address 14 critical success factors/major barriers to the commercialization of MEMS/MST and Nanotechnology and the progress made to date to overcome these barriers through the introduction of a “MEMS/MST Industry Report Card ” for the year 2008. The report card has been updated yearly since 1998 [where it was first presented at the seminal Hilton Head Conference). The changes in grades from 1998 to 2008 will be addressed here with some rationale for the actual grade as well as recommendations for improvement. The focus of the presentation will be MEMS design for test and manufacturing and will address topics, including functional integration, signal conditioning, interconnects, packaging and testing.

The topic of MEMS testing will be addressed specifically from a design for manufacturing perspective. Early in the MEMS product development cycle, it is necessary for the product design, manufacturing and test teams to collaborate closely in order to create an optimum MEMS-BASED SYSTEMS SOLUTION that is robust and can be manufactured and tested in an accurate, high throughput and low cost fashion. We will address some of the challenges that face these development teams and provide recommendations to overcome these issues. Case studies will be presented.

About the Speaker
Roger Grace is president of Roger Grace Associates (Naples, Florida) a marketing consultancy which he founded in 1982. He has over 40 years in the electronics industry holding positions as a circuit designer, project engineer, applications engineer and most recently as a strategic marketing consultant. His focus has been on sensors and especially Microelectromechanical systems (MEMS). He was a co-founder and a past president of the Micro and Nanotechnology Commercialization Education Foundation (MANCEF). Mr. Grace’s educational background includes a BSEE, MSEE from Northeastern University and the MBA program at the University of California Berkeley. He was selected as Northeastern University’s Engineer of the Year in 2004.

Reducing Fallout from Packaging-Test-Trim in High Volume Production of MEMS Devices
Raj Gupta, Owner
Volant Technologies

Abstract
This presentation shall explore the challenges of testing mechanical silicon sensors during production for end packaged solutions. Understanding how and why testing is central to the manufacturing chain is as important as determining how and what solutions can be deployed. Every step during production can contribute to loss, resulting in poorer device performance, reduced yield and throughput, and higher overall cost. Problems manifest all the way from the die level to the selection of packaging material. Catching problems early is critical and reduces cost further downstream. A comprehensive solution for qualification and testing is often required, but may not be economically or strategically viable within the confines of one company. This talk will discuss how designers, foundries, packaging companies, and testing facilities can work together to find effective solutions to validate the process through a common MEMS testing toolset. The presentation will impress upon the attendees the importance of planning for packaging before device design even begins, alleviating fallout during test and qualification, and discuss techniques for improving upon the traditional sequence of packaging, test, and trim.

About the Speaker
Dr. Raj Gupta has been a founder, CTO, engineer, and consultant for more than fifteen companies. He brings over a decade of experience in sensor manufacturing, prototyping, design and micromachining and provides expertise from development to manufacturing to expert witness testimony. As a co-founder and engineering manager at InLight Communications, he invented their all-optical 3D micromechanical switch for fiber-optic switching networks. In 1997 he opened the Bay Area office for Coventor, formerly known as Microcosm Technologies, led their technical sales in the Western US and Asia, and initiated educational outreach programs with UC Berkeley and Stanford.

Dr. Gupta has been with Volant since December 2001, where more recently his jobs have included the development of a client's first sub 1 PSI piezoresistive pressure sensor, modeling acoustical vibrations in piezopolymer (PVDF) microphones, fluid flow analysis in a micro fuel cell, and due diligence on a micromachined technology for improving the efficiency of concentrator photovoltaic systems.

Dr. Gupta is a graduate of the MIT electrical engineering doctorate and masters programs. His Bachelor’s degree is from the University of Illinois at Urbana.

Reliability of Microflow Devices and Systems
A. K. Henning, President
Aquarian Microsystems

Abstract
Microflow systems consist of device components such as microvalves, micropumps, flow channels, pressure sensors, and temperature sensors. When packaged together with command and control electronics, these components enable realization of systems used to monitor and control gases and liquids in industrial applications. These applications range from semiconductor process control, to distribution of refrigerant liquids for air conditioning and refrigeration.

The applications are often demanding in terms of environmental conditions of temperature, shock, and vibration; boundary conditions of pressure; performance conditions of flow; and reliability conditions for such parameters as repeatability, accuracy, and stability under cycling loads. As a consequence, it becomes important to understand the physics of failure in these components and systems, in order to engineer their reliability to meet the highest standards.

This presentation will discuss: the yield and reliability of single-crystal silicon membranes found in MEMS pressure sensors and microvalves; cavitation-related failure mechanisms in thermopneumatically actuated microvalves; burst pressure and proof pressure of package-mounted membrane-based microvalves; and long-term reliability behavior (including long-term drift of mass-flow control systems, consisting of temperature and pressure sensors, a silicon orifice, and a silicon microvalve). Particular attention will be paid to ASME and SEMI standards for microflow systems. Prospects for self-diagnosis and auto-calibration of microflow systems will conclude the discussion.

About the speaker
Albert K. Henning received A.B. and A.M. degrees in physics from Dartmouth College in 1977 and 1979, and the Ph.D. degree in EE from Stanford University in 1987. From 1979 to 1982, he was a Device Physicist with Intel. From 1987 to 1995, he was Professor of Engineering Science at Dartmouth College. In 1996, he joined Redwood Microsystems, where he was Director of Technology until Redwood’s closure in 2006. He joined NanoInk in 2007 as Director of MEMS Technology. His research interests have focused on MOSFET device physics and reliability, scanning probe microscopy for dopant and defect profiling in semiconductor devices and processes, and MEMS device and process design and characterization. He developed two MEMS-related NSF projects: an undergraduate course on MEMS, and a summer workshop on MEMS for minority students. In conjunction with SemiZone.com, he developed a distance learning course on microflow devices. He has published over 60 archival technical papers and holds six U.S. patents. Dr. Henning is a senior member of the IEEE and an active leader the MEMS-related SPIE conferences.

Developing Robust MEMS Reliability, Test and Failure Analysis Systems – A Case Study
John S. McKillop, Ph.D.
Tekton Consulting

Abstract
MEMS devices use semiconductor processes to build mechanical mechanisms that are often difficult to test using standard semiconductor equipment and rarely fail in ways that have anything in common with integrated circuits. While we all believe that our industry will some day develop a body of knowledge comparable to the IC world, in the mean time successful MEMS manufacturers must develop a complete methodology to test their products, identify failure mechanisms, and demonstrate product reliability to their customers. But how do they do this?

This talk will provide a step by step discussion of these topics based on the author’s experience with a variety of MEMS devices – especially RF MEMS switches at TeraVicta Technologies. This includes a discussion of how to use standard semiconductor test equipment to obtain useful failure analysis and parametric test data and real world examples of how to use this data to improve product reliability and yield. Using RF MEMS switches as a specific example, the talk will discuss how to adapt semiconductor reliability and qualification methodologies to MEMS and from this how to develop a comprehensive product test and qualification plan. This will be followed by a discussion of actual methods used to derive meaningful failure accelerants – and how to use those to implement burn-in procedures that successfully remove infant failures from a device population. The talk will then conclude with examples of how to use reliability testing to drive process and product improvement.

About the Speaker
Dr. John McKillop is Managing Director of Tekton Consulting, a leading independent provider of technical business solutions to the MEMS industry. He was previously CTO of Teravicta Technologies and has more than twenty years experience in both Fortune 500 companies and venture backed start-ups, where he has been both a founder and C-level contributor. During his career he has led the commercialization of several MEMS industry firsts – including RF MEMS switches and optical switches & attenuators. He has also grown MEMS companies from start-up through acquisition and integration into Fortune 500 companies, and has been a major contributor to venture backed fundraising rounds and sales of startups totaling more than $650 MM. He received a B.A. in Chemistry from Rice University and a Ph.D. in Chemistry from Stanford University.

High Yield, Manufacturable MOEMS with Extended Shelf Life Reliability
Dan Popa, PhD, Assistant Professor of Electrical Engineering
Automation & Robotics Research Institute at the University of Texas at Arlington

Abstract
Recent advances in micro and nano technology have increased the demand for miniaturized sensors, actuators, and other non-electronic MEMS. For some applications, such as in the defense industry, microdevices must operate reliably in harsh environments, for many years, or even decades. This talk presents recent work on several such optical MEMS with extended shelf lifes of 20 years or more, including microoptomechanical switches and chemical sensors. We employed a systematic approach in the design, manufacturing, and reliability testing, offering both a high manufacturing yield as well as reliability guarantees for the resulting microsystems. Our micromanufacturing approach combines Design for Manufacturing (DoM), Design for Reliability (DfR), automated precision assembly with guaranteed high yields, and advanced 3D packaging. Instead of being added to a manufacturing line at the end of the product development cycle, Test and Reliability considerations were included in the microsystem design from the beginning, concurently with the development of the first prototypes and processes.

About the Speaker
Dan Popa, Ph.D., is presently an Assistant Professor of Electrical Engineering at the Automation & Robotics Research Institute at the University of Texas at Arlington. He received a B.A. in Engineering, Mathematics and Computer Science and a M.S. in Engineering, both from Dartmouth College where he was a Montgomery Scholar from 1990 to 1994. He received a Ph.D. in Electrical Computer and Systems Engineering from Rensselaer Polytechnic Institute (RPI) in 1998, focusing on advanced robotics and control. Until 2004 he was a Senior Research Scientist at RPI’s Center for Automation Technologies (CAT). Dr. Popa has a broad experience base, including the modeling and simulation of non-rigid materials, the design, characterization, modeling and control of MEMS actuators, the design of multiscale assembly architectures, and the development of new systems level processes for hermetic sealing, wafer level bonding, and 3D wafer integration. His current research focuses on design and manufacturing of sensors, actuators and integrated Microsystems and Micro/Nanorobots. As a member of several professional societies, including IEEE, ASME, SME, and IMAPS, he is the recipient of several prestigious awards, and the author of over 100 papers, patents, and book articles.

Maximizing Gross Margins and Achieving Product and Market
Differentiation Through Testing and Qualification
Joe Rash, VP of Marketing and Business Development
CebaTech, Inc.

Abstract
Certain lessons from the general semiconductor IC industry can be applied to high-volume MEMS production and testing. This presentation discusses the use of qualification and test procedures to create differentiated product types using a single base design. Product gross margins are maximized when market specific features can be offered from a single base product with little to no additional production cost. Specific examples from the DRAM market will be used to highlight various low cost methods for product qualification and production ATE test. Examples to be detailed include leveraging differences in market reliability expectations and addressing differences in operating temperature ranges, package mechanical reliability, and standby power.

About the Speaker
Joe Rash has over 20 years of experience with bringing to market complex SOC (system on chip) semiconductor products that address the needs of the data communications and enterprise storage market segments. Joe is presently the VP of Marketing and Business Development at CebaTech Inc., a high-tech startup focused on developing hardware solutions to accelerate complex data networking and storage protocols. Prior to joining CebaTech, Joe held the position of Senior Business Development manager for Qimonda, a leading global supplier of DRAM components and modules. Joe has also held the position of Director of Engineering at Applied Micro Circuits, ASIC Design Manager at Nortel Networks, and Advisory engineer at IBM corporation.

Electrical Characterization of Inertial MEMS Sensors
Firas Sammoura, Senior Device Characterization Engineer
Analog Devices

Abstract
This talk will give an overview of the MEMS activities at the Micromachined Product Division (MPD) of Analog Devices. The presentation will briefly describe the process characterization and concept of operation of a 3D MEMS accelerometer for consumer and automotive applications. The methodologies of characterizing inertial MEMS sensors will be detailed, including: (1) process characterization by electrical test probing, (2) design evaluation of key parameters such as resonant frequency and quality factor, and (3) ambient controlled performance testing."

About the speaker
Firas Sammoura was born in Saida, Lebanon in 1980. He received his BE in mechanical engineering from the American University of Beirut in June 2001 with high distinction. From 2001 until 2006, he was a graduate student researcher at the University of California-Berkeley. In May 2006, he received his Ph.D. in the field of mircoelectromechanical systems. His dissertation focused on building plastic millimeter-wave systems for radar applications at 95GHz. He was a student researcher with Hitachi Global storage Technologies at the Almaden Research Center, where he did proprietary research in MEMS applications for the hard drive disk industry. Firas Sammoura joined Analog Devices in January 2007 as a senior device characterization engineer in the advanced development group at the Micromachined Product Division. He won the spot award for solving a stiction problem that plagued a consumer low-g 3D accelerometer. He has several pending patent applications in the field of microwave engineering and MEMS fabrication and design.

Others to be announced

Sponsorship Opportunities
The MEMS Investor Journal and MEPTEC are offering sponsorship opportunities for their 2nd Annual Workshop on MEMS Test and Reliability. There are four sponsorship levels that will provide sponsors with many benefits not only at the workshop itself, but will also include marketing promotions throughout the year such as targeted e-mail blasts, and banner and print advertising, among others.

Click Button for PDF containing information and pricing.

Pricing/Registration/Cancellation
Guaranteed registration will be accepted by mail, fax, phone or e-mail. Space is available on a first come, first served basis. Pre-registering and pre-paying will guarantee you admission, proceedings materials and lunch. Please note that you may pay at door for attendance, but you must hold your registration with a credit card. There will be an additional $25.00 fee to register at door on the day of the event without a pre-paid or held reservation.

Refunds for advance payment will be given in full provided cancellation is received 3 business days prior to the event (by end of day Friday, October 16). If you chose to pay at the door but do not show and do not cancel 3 business days in advance, the credit card you provide to hold the reservation will be charged.

PLEASE REGISTER BY OCTOBER 16, 2009.

Click Button for pricing and registration.

Registration confirmation, location map and other information will be sent to you.

Hotel Information
A block of rooms are being held as space is available at the Radisson Hotel for a rate of $79.00. The hotel is conveniently located at 1471 North 4th Street, San Jose, CA in close proximity to the San Jose Airport. Call 408-452-0200 or 800-333-3333 to reserve your room. Be sure to mention MEPTEC in order to secure your special rate.